ESP32-C3-MINI-1 is a general-purpose Wi Fi and low-power Bluetooth LE module with small size and rich peripheral interfaces, which can be used in smart home, industrial automation, medical care, consumer electronics and other fields.

characteristic

• CPU and on-chip memory

– Built in ESP32-C3FH4 or ESP32-C3FN4 chip, RISC-V 32-bit single core microprocessor, main frequency up to 160MHz

– 384KB ROM

– 400KB SRAM (16KB is dedicated to cache)

– 8KB RTC SRAM

– 4MB embedded flash

• Wi ­ Fi

– Support IEEE802.11 b/g/n protocol

– Center frequency range of working channel: 2412~2484MHz

– Supports 20MHz and 40MHz bandwidth in the 2.4GHz band

– Support 1T1R mode with data rate up to 150Mbps

– Wireless Multimedia (WMM)

– Frame aggregation (TX/RX A-MPDU, TX/RX A-MSDU)

– Immediate Block ACK

– Fragmentation and defragmentation

– Transmission opportunity (TXOP)

– Beacon automatic monitoring (hardware TSF)

– 4 × Virtual Wi Fi interface

– Support Infrastructure BSS Station mode, SoftAP mode Station+SoftAP mode and hybrid mode at the same time. Please note that when the ESP32-C3 series scans in Station mode, the SoftAP channel will change simultaneously

– 802.11mc FTM

• Bluetooth

– Low power Bluetooth LE: Bluetooth 5, Bluetooth mesh

– The rate supports 125Kbps, 500Kbps, 1Mbps and 2Mbps

– Advertising Extensions

– Multiple Advertisement Sets

– Channel Selection Algorithm # 2

– Wi Fi and Bluetooth coexist and share the same antenna

• Peripherals

– GPIO, SPI, UART, I2C, I2S, remote control peripheral, LED PWM controller, general DMA controller, TWAI ® Controller (compatible with ISO11898-1, i.e. CAN specification 2.0), USB serial port/JTAG controller, temperature sensor, SAR A/D converter, general timer, watchdog timer

• Module integrated elements

– 40MHz integrated crystal oscillator

• Antenna selection

– On board PCB antenna (ESP32-C3-MINI-1)

– Connect external antenna through connector (ESP32-C3-MINI-1U)

• Operating conditions

– Working voltage/supply voltage: 3.0~3.6V

– Operating ambient temperature:

– 85 ° C version module: – 40 ° C~85 ° C

– 105 ° C version module: - 40 ° C~105 ° C

application

• Smart home

– Intelligent lighting

– Smart buttons

– Smart socket

– Indoor positioning

• Industrial automation

– Industrial robots

– Mesh networking

– Human machine interface

– Industrial bus applications

• Healthcare

– Health monitoring

– Infant monitor

• Consumer Electronics

– Smart watches, smart bracelets

– OTT TV box, set-top box equipment

– Wi Fi speakers

– Toys with data upload function and proximity sensing toys

• Smart agriculture

– Intelligent greenhouse

– Intelligent irrigation

– Agricultural robots

• Retail catering

– POS system

– Service robot

• Audio equipment

– Network music player

– Audio streaming device

– Webcast

• Universal low power IoT sensor hub

• General purpose low-power IoT data recorder

Functional block diagram

The AP8000 multi-purpose burner independently developed by ACROVIEW Technology consists of three parts: host, base plate and adapter.

The host supports USB and NET connection, allowing multiple automatic programming burners to be networked, so as to control multiple programmers to programmer at the same time. The built-in chip safety protection circuit ensures that even if the chip is put upside down or the short circuit caused by other reasons can be detected immediately and power off treatment can be carried out to ensure the safety of the chip and the programmer. Embedded high-speed FPGA, greatly accelerating data transmission and processing. There is an SD card slot on the back of the host computer. Put the project files made by PC software into the root directory of the SD card and insert them into the card slot. With the keys on the programmer, you can select, load, and execute commands such as burning the project files, so that you can operate without a PC, greatly reduce the cost of PC hardware configuration, and easily and quickly match the working environment.

The AP8000 makes the host more scalable by adding an adapter board to the backplane. At present, it has supported devices produced by all major semiconductor manufacturers, including TI, ST, MicroChip, Atmel, Hynix, Macronix, Micron, Samsung, Toshiba, etc. Supported device types include NAND, NOR, MCU, CPLD, FPGA, EMMC, etc., and supported file formats including Intel Hex, Motorola S, Binary, POF, etc.

Company Profile

About Lexin Technology: Espressif, a global fabless semiconductor company, was founded in 2008, with offices in China, the Czech Republic, India, Singapore and Brazil, and teams from about 30 countries and regions. Over the years, Le Xin has been deeply engaged in the research, development and design of software and hardware products in the AIoT field, focusing on the research and development of wireless communication SoC with high integration, low power consumption, excellent performance, security and stability, and high cost performance. Now, it has released ESP8266, ESP32, ESP32-S, ESP32-C, and ESP32-H series chips, modules, and development boards.

About ACROVIEW Technology: ACROVIEW is a leading global provider of semiconductor chip burning solutions. The company insists on changing the world with technology, driving the future with intelligence, and continuously creating value for customers. Onco's AP8000 universal burner platform and the latest IPS5000 burning automation solution provide one-stop solutions for customers in the semiconductor and electronic manufacturing fields. The company has served leading customers in the world, including Huawei, BYD, Foxconn, etc.