2024-08-05
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2024-03-12
2023-12-20
2023-12-20
2023-12-18
Address: 3F , Blg 7 West, Sinosteel Building,Maque Industry Village Nanshan,Shenzhen,518057,Guangdong
Phone: +86-755-26971006
Mobile: 13751075276
Email: sales@acroview.com
Dear All:
昂科软件_ V1.05.05(20220716)今日发布,如有需要,请前往官网下载,链接:
下载链接(先注册-登录-再到软件下载中心-下载):https://www.acroview.com/member/login/
更新芯片列表如下:
V1.05.05_20220716 | ||||||
Acroview | Programmer Type | Items | Manufacture | Chip Name | Package | Adapter |
Adesto | AT45DB081D-S(264Byte/page) | SO8W(208mil) | SO8(210)-AG02 | |||
Adesto | AT45DB081D-S*-SL(256Byte/page) | SO8W(208mil) | SO8(210)-AG02 | |||
Adesto | AT45DB081E-S*N(264Byte/page) | SO8W(208mil) | SO8(210)-AG02 | |||
Adesto | AT45DB081E-S*N2B(256Byte/page) | SO8W(208mil) | SO8(210)-AG02 | |||
Adesto | AT45DB081E-SS*N(264Byte/page) | SO8N(150mil) | SO8(150)-AG21 | |||
Adesto | AT45DB081E-SS*N2B(256Byte/page) | SO8N(150mil) | SO8(150)-AG21 | |||
ArteryTek | AT32F425R8T | LQFP64(10x10) | TQFP64(10x10)-AG01(F) | |||
ChipON(KungFu) | KF32A140IQS | TQFP48(7x7) | TQFP48(7x7)-AG106 | |||
ChipSea | CS32L010F8U | QFN20(3x3) | QFN20(3X3)-AG20 | |||
Cypress | CY9BF121KPMC | LQFP48(7x7) | TQFP48(7x7)-AG113 | |||
CYPD5137-40LQ | QFN40(6x6) | QFN40(6x6)-AG17 | ||||
Cypress | CYT2B98CACQ0AZSGS(ISP-SWD-5VTTL) | NULL | ISP-AG08 | |||
Cypress | CY9AF116NA | TQFP100(14x14) | TQFP100(14x14)-AG127 | |||
Cypress | CYT4BB8CEBQ0AESGS | TEQFP176(24x24) | PQFP176(24x24)-AG24 | |||
Cypress | CY95F778EPMC1-G-SNE2 | TQFP64(10x10) | TQFP64(10x10)-AG126 | |||
ENE | TK18A28Q4B | LQFP44(10x10) | LQFP44(10x10)-AG51 | |||
FitiPower | EK86313A | QFN46(6.5x4.5) | QFN46(6.5x4.5)-S02 | |||
GOODIX | GR5515GGBD(XETG) | BGA55(3.5x3.5) | BGA55(3.5x3.5)-AG01 | |||
Hisilicon | Hi3861V100 | QFN32(5x5) | QFN32(5x5)-AG68 | |||
HuaHong | HE24C08DF | DFN8(2x3mm) | DFN8(2x3)-AG02 | |||
HuaHong | HE24C08SO | SO8(150mil) | SO8(150)-AG03 | |||
HuaHong | HE24C08TS | TSSOP8 | TSSOP8-AG01 | |||
TLE4988C(ISP-SMI) | NULL | ISP-S11 | ||||
Infineon | SAK-TC377T*-96F | BGA292(17x17) | BGA292(17x17)-AG02(A) | |||
Infineon | SAK-TC387Q*-160F | BGA292(17x17) | BGA292(17x17)-AG02(A) | |||
IntelliGo | IG1202 | QFN28(4x4) | QFN28(4x4)-AG13 | |||
ISSI | IS25WP01G-JI | 24-Ball TFBGA24(5x5 ball,6x8mm) | TBGA24(8x6)-AG01(CS) | |||
ISSI | IS25WP01G-JI | 24-Ball TFBGA24(5x5 ball,6x8mm) | TBGA24(8x6)-AG01 | |||
ISSI | IS25WP01G-KI | 24-Ball TFBGA24(5x5 ball,6x8mm) | TBGA24(8x6)-AG01(CS) | |||
ISSI | IS25WP01G-KI | 24-Ball TFBGA24(5x5 ball,6x8mm) | TBGA24(8x6)-AG01 | |||
ISSI | IS25WP01G-QI | 24-Ball TFBGA24(5x5 ball,6x8mm) | TBGA24(8x6)-AG01(CS) | |||
ISSI | IS25WP01G-QI | 24-Ball TFBGA24(5x5 ball,6x8mm) | TBGA24(8x6)-AG01 | |||
ISSI | IS25WP01G-RI | 24-Ball TFBGA24(5x5 ball,6x8mm) | TBGA24(8x6)-AG01(CS) | |||
ISSI | IS25WP01G-RI | 24-Ball TFBGA24(5x5 ball,6x8mm) | TBGA24(8x6)-AG01 | |||
ISSI | IS25WP01G-TI | 24-Ball TFBGA24(5x5 ball,6x8mm) | TBGA24(8x6)-AG01(CS) | |||
ISSI | IS25WP01G-TI | 24-Ball TFBGA24(5x5 ball,6x8mm) | TBGA24(8x6)-AG01 | |||
Lattice | LFMNX-50-*CBG256 | BGA256(14x14) | BGA256(14x14)-AG02 | |||
Melexis | MLX81332 | QFN24(4x4) | QFN24(4x4)-AG37 | |||
Melexis | MLX81315(ISP-PTVC-3V3TTL-12V) | NULL | ISP-AG02 | |||
dsPIC33CK32MC105 | TQFP48(7x7) | TQFP48(7x7)-AG94 | ||||
Microchip | PIC12LF1572-*/SN | SOIC8(150) | SO8(150)-AG02 | |||
Microchip | PIC16LF15376T-*/MV | QFN40(5x5) | QFN40(5x5)-AG66 | |||
Micron | MT25QL128ABA1EW7-0 | W-PDFN8(6x5) | VPDFN8(6x5)-AG01 | |||
Nation | N32G031C8L | TQFP48(7x7) | TQFP48(7x7)-S115 | |||
Nuvoton | NUC029ZAN | QFN32(5x5) | QFN32(5x5)-AG48 | |||
NXP | MK70FN1M0*MJ15 | BGA256(17x17) | BGA256(17x17)-AG15 | |||
NXP | S9S12G64*LF | TQFP48(7x7) | TQFP48(7x7)-AG26 | |||
NXP | LPC54616J256ET180 | BGA180(12x12) | BGA180(12x12)-AG03 | |||
NXP | MC9S08GT16A*FD | QFN48(7x7) | QFN48(7x7)-AG67 | |||
Renesas | R5F10Y17*SP | SSOP10(4.4x3.6) | SSOP10(4.4x3.6)-AG01 | |||
Silan | SC32F5664LL1G | LQFP48 | TQFP48(7x7)-AG05(C) | |||
Silicon Laboratories | EFR32FG23B020F512*M40 | QFN40(5x5) | QFN40(5x5)-AG96 | |||
SinOne | SC95F8523X28 | TSSOP28 | TSSOP28-S08 | |||
ST | STM32L433CCY(ISP-SWD-3.3VTTL-3.3V) | NULL | ISP-AG08 | |||
ST | STM32H743IIT | LQFP176(24x24) | PQFP176(24x24)-S04 | |||
ST | STM32WB55VGY(APP+Option) | WLCSP100(4.40x4.38) | WLCSP100(4.40x4.38)-AG01 | |||
TI | TMS570LS0432(ISP-JTAG-3.3V) | NULL | JTAG(C2000)-S01 | |||
TI | CC1310F128RHB | QFN32(5x5) | QFN32(5x5)-AG17 | |||
TI | TMS320F28384SZWT | BGA337(16x16) | BGA337(16x16)-S04 | |||
UnicMicro | UM8004-ACTE | TSSOP20 | TSSOP20(4.4x6.5)-AG44 | |||
Winbond | W25Q64JVSS*Q | SOIC8(208mil) | SO8(210)-AG01 | |||
Zetta | ZD25Q32CE | USON8(2x3mm) | DFN8(2x3)-AG01 | |||
Zetta | ZD25Q32CO | TSSOP8 | TSSOP8-AG02 | |||
Zetta | ZD25Q32CS | SOP8(208mil) | SO8(210)-AG01 | |||
Zetta | ZD25Q32CT | SOP8(150mil) | SO8(150)-AG01 | |||
Update Devices | Microchip | PIC12F629-*/SN | SO8(150mil) | SO8(150)-AG02 | ||
FMD | FT32F072X8 | QFN28(4x4) | QFN28(4x4)-AG01(F) | |||
Realtek | RTL8753BFE(XETG) | QFN40(6x4) | QFN40(6x4)-AG01 | |||
SinoWealth | SH32F9801*P_044PR(HEX) | LQFP44(10x10) | LQFP44(10x10)-AG44 | |||
GigaDevice | GD32F303RCT | LQFP64(10x10) | TQFP64(10x10)-AG01(F) | |||
NXP | FS32K148*****MH | BGA100(11x11) | BGA100(11x11)-S02 | |||
NXP | FS32K144*****LH | LQFP64(10x10) | TQFP64(10x10)-AG25 | |||
TI | TMS320F28377DZWT(Flash) | BGA337(16x16) | BGA337(16x16)-S01 | |||
ChipSea | CSU38F16 | QFN20(3x3) | QFN20(3x3)-AG16 | |||
MPS | MP2975 | QFN40(5x5) | QFN40(5x5)-AG36 | |||
ChipSea | CS32F031*8(ISP-SWD-5.0VTTL-5.0V) | NULL | ISP-AG08 | |||
Cypress | CY8C4014LQI-422 | QFN24(4x4) | QFN24(4x4)-S24 | |||
Winbond | W25Q64JVSS*G | SOIC8(208mil) | SO8(210)-AG01 | |||
Winbond | W25Q64JVSS*M | SOIC8(208mil) | SO8(210)-AG01 | |||
Winbond | W25Q64JVSS*Q | SOIC8(208mil) | SO8(210)-AG01 | |||
Winbond | W25Q64JWBY*M | WLCSP12(3.26x1.91) | WLCSP12(3.26x1.91)-AG01 | |||
Winbond | W25Q64JWBY*Q | WLCSP12(3.26x1.91) | WLCSP12(3.26x1.91)-AG01 | |||
Winbond | W25Q64JWSS*Q | SOIC8(208mil) | SO8(210)-AG01 | |||
Winbond | W25Q64JWTB*Q | TFBGA24 8x6mm(5x5 ball array) | TBGA24(8x6)-AG01 | |||
Winbond | W25Q64JWUU*Q | USON8(3x4mm) | DFN8(3x4)-AG01 | |||
Winbond | W25Q64JWXG*Q | XSON8(4x4mm) | DFN8(4x4)-AG01 | |||
Winbond | W25Q64JWZE*Q | WSON8(8x6mm) | VPDFN8(8x6)-AG01 | |||
Winbond | W25Q64JWZP*Q | WSON8(6x5mm) | VPDFN8(6x5)-AG01 | |||
Microchip | ATtiny1606-M | QFN20(3x3) | QFN20(3x3)-AG11 | |||
ST | STM32L433CCY | WLCSP49(3.141x3.127) | WLCSP49(3.141x3.127)-AG01 | |||
Dosilicon | DS29S01GA | TSOP56 | TSOP56(14x20)-AG01 | |||
Microchip | CEC1702 | BGA84(7x7) | BGA84(7x7)-S02 | |||
Lattice | LCMXO3LF-4300C(ISP-SPC1) | NULL | ISP(DAP)-AG01 | |||
Cypress | CY8C20536A-24PVXI | SSOP48(300) | SSOP48(300)-AG01 | |||
Cypress | S26HS01GT**B**03 | FBGA 24-Ball(5x5Array,8x8mm) | BGA24(8x8)-AG01 | |||
GUI modifcations | V1.3.64(20220714) | |||||
Firmware modifications | ||||||
MultiAprog modifications | V1.2.41(20220715) |
Last article:昂科IC自动烧录器_自动化烧录机 _在线编程器_临时版本发布_V1_05_05t1(20220716)
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