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昂科烧录器软件_ V1.05.21(20230304)今日发布

Time:2023-03-05   Visits:3795

Hi  All：

 

昂科软件_ V1.05.21(20230304)今日发布，如有需要，请前往官网下载，链接:

下载链接（先注册-登录-再到软件下载中心-下载）https://www.acroview.com/member/login/

 

A：手动烧录器：AP8000、AP8000F、PT100

B：ic自动烧录机：IPS7000、IPS5000、IPS-MINI PRO、PH-A2000、IPS3000、EAP5000、IPS5100、IPS5200

更新芯片列表如下：


更新芯片列表如下：

                                                            V1.05.21_20230304
AcroviewProgrammer TypeItemsManufactureChip NamePackageAdapterDescription
New DevicesActionsATS2853(SPC1)QFN48(6x6)QFN48(6x6)-AG84
AdestoAT25SF641-S*BSO8(210mil)SO8(210)-AG01
AllegroA5931GESTR-TQFN24(4x4)QFN24(4x4)-AG03
AllegroA5932GESSR-1-TQFN24(4x4)QFN24(4x4)-AG06
AllegroA5932GESSR-TQFN24(4x4)QFN24(4x4)-AG06
AnalogixANX7411QFN28(4x4)QFN28(4x4)-AG20
BOSCHSMA750(ISP-PSI5)NULLISP(SPC)-S19
CypressCY91F526JSE-GSE2LQFP120(16x16)TQFP120(16x16)-AG10
EastsoftHR7P170FHSSO20(300)SO20(300)-AG18
EastsoftHR7P201FHSSO20(300)SO20(300)-AG18
EastsoftHR7P201FHS3SO16(150)SO16(150)-AG12
GigaDeviceGD32FFPRTGUQFN36(6x6)QFN36(6x6)-AG01
GigaDeviceGD25LD80EEUSON8(3x2mm)DFN8(2x3)-AG01
GigaDeviceGD25LD80EKUSON8(1.5x1.5)DFN8(1.5x1.5)-AG01
GigaDeviceGD25LD80ETSOP8(150mil)SO8(150)-AG01
GigaDeviceGD25WD80EEUSON8(3x2mm)DFN8(2x3)-AG01
GigaDeviceGD25WD80EKUSON8(1.5x1.5)DFN8(1.5x1.5)-AG01
GigaDeviceGD25WD80ETSOP8(150mil)SO8(150)-AG01
GigaDeviceGD25LF80EEUSON8(3x2mm)DFN8(2x3)-AG01
GigaDeviceGD25LF80ENUSON8(3x4mm)DFN8(3x4)-AG01
GigaDeviceGD25LF80ESSOP8(208mil)SO8(210)-AG01
GigaDeviceGD32E503RCTTQFP64(10x10)TQFP64(10x10)-AG01(F)
HisiliconSD5006RNIV100(P+D)QFN40(6x6)QFN40(6x6)-S03
HisiliconSD5006RNIV101(P+D)QFN48(7x7)QFN48(7x7)-S42
HisiliconSD5006RNIV101-ICBoard(P+D)QFN42(17x20)QFN42(17x20)-S01
HisiliconSD5006RQIV103(P+D)TQFP64(10x10)TQFP64(10x10)-S43
HisiliconSD5006RQIV103-ICBoard(P+D)QFN54(20x22)QFN54(20x22)-S01
HYCONHY16F198B-L064LQFP64(10x10)TQFP64(7x7)-AG118
INDIEIND83211QFN48(6x6)QFN48(6x6)-AG76
ITEIT8857FNQFN56(6x6)QFN56(6x6)-AG09
MicrochipPIC16F1823-*/MLQFN16(4x4)QFN16(4x4)-AG01
MicrochipPIC16F1829-*/MLQFN20(4x4)QFN20(4x4)-AG01
MPSMAC1678GQNTQFN56(7x7)QFN56(7x7)-AG35
MTMicrosystemsMT6AGCS(TEST029)QFN16(4.8x4.8)QFN16(4.8x4.8)-AG01
NumonyxPC28F128P33BBGA64(8x10mm)BGA64(8x10)-AG01
NumonyxPC28F128P33BBGA64(8x10mm)BGA64(8x10)-AG01(CS)
NXPSPC5606BF1*LQTQFP144(20x20)TQFP144(20x20)-AG10
NXPFXLS93230(ISP-PSI5)NULLISP(SPC)-S19
NXPNCF29A3XHNQFN32(5x5)QFN32(5x5)-S32
NXPS9S08DZ96F2*LHTQFP64(10x10)TQFP64(10x10)-AG08
RenesasR7FA2E1A7*CFLTQFP48(7x7)TQFP48(7x7)-AG149
RICHTEKRT7807N-AQFN32(4x4)QFN32(4x4)-AG68
SanDiskSDINBDA6-256GBGA153(11.5x13)BGA153(11.5x13)-AG01
STMT6AGCS(TEST029)-STQFN16(4.8x4.8)QFN16(4.8x4.8)-AG01
STSTM32WB55*G(FUS+BLEStack+APP+Option)(ISP-SWD-3V-SPC0022)NULLISP-AG08
STSTM32F103VGTLQFP100(14x14)TQFP100(14x14)-AG07(F)(CS)
TIBQ27500QFN12(4x2.5)QFN12(4x2.5)-AG02
TITPS536C7(HEX)QFN48(6x6)QFN48(6x6)-AG46
TITMS320F28035(ISP-JTAG-3.3VTTL-3.3V)NULLJTAG(C2000)-S01
ToshibaTHGBMJG6C1LBAU7BGA153(11.5x13)BGA153(11.5x13)-AG01
YMTCYMEC7BOTE1A2C3BGA153(11.5x13)BGA153(11.5x13)-AG01
Update DevicescFeonEN25QH16B-***HSOP8(200mil)SO8(210)-AG01Update: After burning CMP, there is no way to re-burn the flash area

(Must carefully confirm config option and redo project load burning)
CypressCYPD5225-96BZXBGA96(6x6)BGA96(6x6)-S02Update: Solve the problem that some chips fail to enter mode and the data is changed after burning customer files

(Must carefully confirm config option and redo project load burning)
elmosE52417A(SPC)QFN20(5x5)QFN20(5x5)-AG04Update: To solve the problem of burning CC address data is not correct, add Secure Verify

(Must carefully confirm config option and redo project load burning)
GigaDeviceGD32F470ZGTTQFP144(20x20)TQFP144(20x20)-AG06Update: Fix stability issues and speed up

(Must carefully confirm config option and redo project load burning)
iCommSemiSV32WB01LQFN32(4x4)QFN32(4x4)-AG43Update: Solve the problem of CHECKSUM failure when customers burn SV32WB01L chip files larger than 1M

(Must carefully confirm config option and redo project load burning)
KIOXIATC58CYG1S3HRAIJWSON8(8x6mm)VPDFN8(8x6)-AG01Update: Fixed number of blocks and buffer range

(Must carefully confirm config option and redo project load burning)
MicrochipdsPIC33CK256MP503(SINGLE)QFN36(5x5)QFN36(5x5)-AG01Update: Solve some chip burning failure problem

(Must carefully confirm config option and redo project load burning)
MicrochipATSAME51J18A-ATQFP64(10x10)TQFP64(10x10)-AG80Update: Solve the Reserved bit does not burn no check problem

(Must carefully confirm config option and redo project load burning)
MPSMP2845BGQKQFN56(6x6)QFN56(6x6)-AG08What's New: Modified the Check ID flow and password processing flow

(Must carefully confirm config option and redo project load burning)
NationN32G435CBLTQFP48(7x7)TQFP48(7x7)-AG73Update: Resolve erasing failure and report check failure when burning

(Must carefully confirm config option and redo project load burning)
NXPMC33PF8200A0ESQFN56(8x8)QFN56(8x8)-AG06Update: Add UID read

(Must carefully confirm config option and redo project load burning)
NXPMC33PF8100A0ESQFN56(8x8)QFN56(8x8)-S05Update: Add UID read

(Must carefully confirm config option and redo project load burning)
NXPMC34PF8100A0EPQFN56(8x8)QFN56(8x8)-S05Update: Add UID read

(Must carefully confirm config option and redo project load burning)
NXPS32K314EHT1*PBMAXQFP172(16x16)MAXQFP172(16x16)-AG01Update: Solve the problem of checking failure when burning

(Must carefully confirm config option and redo project load burning)
RealtekRTL8762DKQFN48(6x6)QFN48(6x6)-S28Update: Solve the problem of unstable burning

(Must carefully confirm config option and redo project load burning)
RenesasR7F701649*AFPPQFP176(24x24)PQFP176(24x24)-4-AG29Update: Customer part of the material erasure failed

(Must carefully confirm config option and redo project load burning)
RenesasR7F701374A*AFPLQFP144TQFP144(16x16)-AG02New: Added functions of Code ID and Data ID

(Must carefully confirm config option and redo project load burning)
WinbondW25N01GWZEIGWSON8(8x6mm)VPDFN8(8x6)-AG01Update: Fixed multiple seat son erasing bad block failure

(Must carefully confirm config option and redo project load burning)
WinbondW25Q128JVSIMSOIC8(208mil)SO8(210)-AG01New: Changed the default QE value

(Must carefully confirm config option and redo project load burning)
GUI modifcationsV1.4.11(20230220) 1、取消”Intel Hex”限制，可以对所有档案解析负偏移
Firmware modifications
MultiAprog modificationsV1.2.99(20230223) 1、多站点初始化由串行改成并行，加快启动速度     2、新增对Bottom Board-AG07的支持


------------------Best wishes--------------------



昂科技术成立于2013年2月，2016年被认定为国家高新企业和深圳市高新企业，并取得多项软件著作权以及专利，昂科核心人员均拥有编程设备研发、制造以及服务领域十多年的丰富经验，具有世界领先技术，并致力于为客户提供创新的IC编程器解决方案和产品。正努力为编程设备的可靠性、安全性以及知识产权保护方面做出杰出贡献。昂科始终坚信对品质与技术的追求会使越来越多的电子厂商选择昂科作为他们值得信赖的合作伙伴，新产品持续在发布中，请保持关注。


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