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烧录软件正式版本更新V1.05.50_20240403_昂科技术

Time:2024-04-07   Visits:2816

尊敬的昂科烧录器用户:

您好,十分荣幸和您一起交流学习IC芯片烧录技术与知识分享。现在为您更新AP8000烧录软件正式版本V1.05.50_20240403

下载链接(先注册-登录-再到软件下载中心-下载)https://www.acroview.com/member/login/

昂科自主研发的烧录核心AP8000可支持的芯片种类有Nor Flash/Nand flash. eMMC、UFS、 EEPROM、 EPROM、MCU、CPLD、 CMOS PLD.。

包括TSOP, BGA, QFP, TSSOP, FBGA, TQFP, CSP, uBGA, PLCC, SOP, PoP, SSOP, TFBGA,WLCSP等多种封装。

其中烧录器软件适用机型:

芯片烧录器AP8000、AP8000F、PT100

自动IC烧录机PH-A2000+、IPS5000、IPS-MINI PRO、PH-A2000、IPS3000、EAP5000、IPS5100、IPS5200


更新芯片列表如下:

V1.05.50_20240403
ManufactureChip NamePackageAdapter
ArteryTekAT32F405KCUQFN32(4x4)QFN32(4x4)-AG99
AtmelATMEGA128L-AUTQFP64(14x14)TQFP64(14x14)-AG04
BiwinBWCTAKJ11X64GBGA153(11.5x13)BGA153(11.5x13)-AG01
CmsemiconCMS79FT738TSSOP28TSSOP28-AG27
CypressCYAT81688-100A*61KHTQFP100(14x14)TQFP100(14x14)-AG06
EspressifCMB02-V11QFN16(33x23)QFN16(33x23)-4-AG01
FMDFT24C08A-KLSOT23-5(2.9x1.6)SOT23-5(2.9x1.6)-AG01
Fortior TechFU6812VSSOP24(8.65x3.9)SSOP24(8.65x3.9)-AG01
GigaDeviceGD25LF128JBTFBGA24(5x5 BallArray)TBGA24(8x6)-AG01(CS)
GigaDeviceGD25LF128JBTFBGA24(5x5 BallArray)TBGA24(8x6)-AG01
GigaDeviceGD25LF128JFSOP16SO16(300)-AG01
GigaDeviceGD25LF128JQUSON8(4x4mm)DFN8(4x4)-AG01
GigaDeviceGD25LF128JSSOP8(208mil)SO8(210)-AG01
GigaDeviceGD25LF128JWWSON8(6x5mm)VPDFN8(6x5)-AG01
GigaDeviceGD25LF128JYWSON8(8x6mm)VPDFN8(8x6)-AG01
GigaDeviceGD25LR512MFBTFBGA24(5x5 BallArray)TBGA24(8x6)-AG01(CS)
GigaDeviceGD25LR512MFBTFBGA24(5x5 BallArray)TBGA24(8x6)-AG01
GigaDeviceGD25LR512MFFSOP16(300mil)SO16(300)-AG01
GigaDeviceGD25LR512MFYWSON8(8x6mm)VPDFN8(8x6)-AG01
GigaDeviceGD25NF512MFBTFBGA24(5x5 BallArray)TBGA24(8x6)-AG01(CS)
GigaDeviceGD25NF512MFBTFBGA24(5x5 BallArray)TBGA24(8x6)-AG01
GigaDeviceGD25NF512MFFSOP16(300mil)SO16(300)-AG01
GigaDeviceGD55LF01GFBTFBGA24(5x5 BallArray)TBGA24(8x6)-AG01(CS)
GigaDeviceGD55LF01GFBTFBGA24(5x5 BallArray)TBGA24(8x6)-AG01
GigaDeviceGD55LF01GFFSOP16(300mil)SO16(300)-AG01
GigaDeviceGD55LF01GFYWSON8(8x6mm)VPDFN8(8x6)-AG01
GigaDeviceGD55LF02GFBTFBGA24(5x5 BallArray)TBGA24(8x6)-AG01(CS)
GigaDeviceGD55LF02GFBTFBGA24(5x5 BallArray)TBGA24(8x6)-AG01
GigaDeviceGD32F450*I(ISP-SWD-3.3VTTL-3.3V)NULLISP(DAP)-AG01
HDSCHD8122(SPC)QFN40(5x5)QFN40(5x5)-AG120
HEDHD8125(SPC)BGA48(3x3)BGA48(3x3)-AG01
HimaxHA5820-A01QFN40(5x5)QFN40(5x5)-S141
LinkoLKS32AT086N8QQFN52(6x6)QFN52(6x6)-AG17
MicrochipPIC18F4525-*/PTLQFP44(10x10)LQFP44(10x10)-AG08
MicrochipATSAMD20G15A-MQFN48(7x7)QFN48(7x7)-AG69
MindMotionMM32F5333D7PLQFP64(10x10)TQFP64(10x10)-AG171
MontageM88SPD5118A5DFN8(2x3)DFN8(2x3)-AG06
MPSMPQ2967GQKQFN40(6x6)QFN40(6x6)-AG78
MPSMPQ2967GQK(ISP-IIC-3.3VTTL-5V)NULLISP(DAP)-AG01
MPSMP2845BGQK(TEST038)QFN56(6x6)QFN56(6x6)-4-AG08
MPSMP29000GQKT(TEST038)QFN56(6x6)QFN56(6x6)-4-AG07
NuvoltaNU1668WLCSP54(2.8x4.0)WLCSP54(2.8x4.0)-AG01
NuvotonNSP082ASO8(150mil)SO8(150)-AG08
NXPFS2320B*BA0EPQFN48(7x7)QFN48(7x7)-AG103
NXPS32K324EHT1*PBMAXQFP172(16x16)MAXQFP172(16x16)-AG01
NXPS32K344EHT1*PBMAXQFP172(16x16)MAXQFP172(16x16)-AG01
PhisonPTE7A0MI-32GXBGA153(11.5x13)BGA153(11.5x13)-AG01
PhisonPTE7A0MI-64GXBGA153(11.5x13)BGA153(11.5x13)-AG01
RenesasR7F701690*AFP(ISP-UART-3.3VTTL-3.3V)NULLISP-AG02
RICHTEKRT3645BEN_REVBQFN52(6x6)QFN52(6x6)-AG10
RICHTEKRT3645BENQFN52(6x6)QFN52(6x6)-AG10
Silicon LaboratoriesEFR32BG21B010F1024*M32QFN32(4x4)QFN32(4x4)-AG19
Silicon LaboratoriesEFR32MR21A020F512*M32QFN32(4x4)QFN32(4x4)-AG19
STSTM32G031C8TTQFP48(7x7)TQFP48(7x7)-AG216
STSTM32F746*G(ISP-SWD-3.3VTTL-3.3V)NULLISP(DAP)-AG01
STSTM32G484CBTLQFP48(7x7)TQFP48(7x7)-AG85
STSTM32G484CBT(Optimizer)LQFP48(7x7)TQFP48(7x7)-AG85
STSTM32G484CBT(SINGLE)LQFP48(7x7)TQFP48(7x7)-AG85
TITMS320LF2407APGETQFP144(20x20)TQFP144(20x20)-S148
TITMS320F28P650DK9NMRBGA169BGA169(9x9)-AG02
TITMS320F28375S(ISP-JTAG-3.3VTTL-3.3V)NULLJTAG(C2000)-AG01(B)
WinbondW25Q10RLSS*QSOIC8(208mil)SO8(210)-AG01
WinbondW25Q10RLSN*QSOIC8(150mil)SO8(150)-AG01
WinbondW25Q10RLXH*QXSON8(2x3)DFN8(2x3)-AG01(CS)
WinbondW25Q10RLXH*QXSON8(2x3)DFN8(2x3)-AG01
WinbondW25Q16RVSN*QSO8(150mil)SO8(150)-AG01
WinbondW25Q16RVSS*QSO8(208mil)SO8(210)-AG01
WinbondW25Q16RVXH*QXSON8(2x3)DFN8(2x3)-AG01(CS)
WinbondW25Q16RVXH*QXSON8(2x3)DFN8(2x3)-AG01
WinbondW25Q16RVZP*QWSON8(6x5mm)VPDFN8(6x5)-AG01
WinbondW25Q20RLSN*QSOIC8(150mil)SO8(150)-AG01
WinbondW25Q20RLSS*QSOIC8(208mil)SO8(210)-AG01
WinbondW25Q20RLXH*QXSON8(2x3)DFN8(2x3)-AG01(CS)
WinbondW25Q20RLXH*QXSON8(2x3)DFN8(2x3)-AG01
WinbondW25Q32RVSN*QSO8(150mil)SO8(150)-AG01
WinbondW25Q32RVSS*QSO8(208mil)SO8(210)-AG01
WinbondW25Q32RVXH*QXSON8(2x3)DFN8(2x3)-AG01(CS)
WinbondW25Q32RVXH*QXSON8(2x3)DFN8(2x3)-AG01
WinbondW25Q32RVZP*QWSON8(6x5mm)VPDFN8(6x5)-AG01
WinbondW25N01KWZE*GWSON8(8x6mm)VPDFN8(8x6)-AG01
WinbondW25N01KWZE*RWSON8(8x6mm)VPDFN8(8x6)-AG01
WinbondW25N01KWZE*TWSON8(8x6mm)VPDFN8(8x6)-AG01
WinbondW25N01KWZP*GWSON8(6x5mm)VPDFN8(6x5)-AG01
WinbondW25N01KWZP*RWSON8(6x5mm)VPDFN8(6x5)-AG01
WinbondW25N01KWZP*TWSON8(6x5mm)VPDFN8(6x5)-AG01
XilinxXCF04SVOG20TSSOP20(4.4x6.5)TSSOP20(4.4x6.5)-AG90
ZhiXinZ20K116(ISP-SWD-3.3VTTL-3.3V)NULLISP-AG08
ZhiXinZ20K116(ISP-SWD-3.3VTTL-5V)NULLISP-AG08
ZhiXinZ20K146(ISP-SWD-3.3VTTL-3.3V)NULLISP-AG08
RealtekMHCB05P-BQFN35(23.5x13)QFN35(23.5x13)-4-AG01
AlleMMCManueMMC-TGenericBGA153(11.5x13)BGA153(11.5x13)-AG01
ChipSeaCS32L010F8UQFN20(3x3)QFN20(3X3)-AG20
GigaDeviceGD32F425VGTLQFP100(14x14)TQFP100(14x14)-AG74
MelexisMLX81344*LW-BM*-003(ISP-PPM-4VTTL-5V)NULLISP-AG02
MPSMP29000GQKTQFN56(6x6)QFN56(6x6)-AG07
MPSMP29001GQKTQFN56(6x6)QFN56(6x6)-AG07
NXPMC56F82726(ISP-JTAG-3.3VTTL-3.3V)NULLISP-AG21
RenesasR7F701581*AFPTQFP100(14x14)TQFP100(14x14)-AG32
RenesasSPD5118DFN8(2x3)DFN8(2x3)-AG06
TIUCD90120A(P+D)QFN64(9x9)QFN64(9x9)-S10
WinbondW25Q32JW*M(ISP-SPI-1.8VTTL-3.3V-12M5)NULLISP(SPI)-AG01




昂科技术简介


昂科技术成立于2013年2月,2016年被认定为国家高新企业和深圳市高新企业,并取得多项软件著作权以及专利,昂科核心人员均拥有编程设备研发、制造以及服务领域十多年的丰富经验,具有世界领先技术,并致力于为客户提供创新的芯片烧录器解决方案和产品。正努力为编程设备的可靠性、安全性以及知识产权保护方面做出杰出贡献。昂科始终坚信对品质与技术的追求会使越来越多的电子厂商选择昂科作为他们值得信赖的合作伙伴,新产品持续在发布中,请保持关注。

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