Leading chip programming provider Acroview Technology, while releasing a new version of its programming software, announced the expansion of its compatible chip model range. Among them, the company's universal programming platform, the AP8000, has been fully adapted to support Telink's wireless system-on-chip TLSR8208CER, providing customers with efficient and reliable professional programming support.

TLSR8208CER is a low-power Bluetooth and 2.4GHz multi-standard wireless system-on-chip (SoC) independently developed by Telink. The chip's built-in 2.4GHz RF transceiver supports both low-power Bluetooth communication and 2.4GHz wireless operations, fully compliant with RoHS directives and manufactured using a 100% lead-free (Pb) process.

TLSR8208CER integrates RF, digital processing units, multi-standard protocol stack software, and application specifications into a single chip, supporting standards and industry alliance specifications including low-power Bluetooth and various 2.4GHz proprietary protocols. The chip features hardware-level Over-The-Air (OTA) upgrade functionality and supports multi-boot mode switching, enabling flexible deployment and convenient upgrades for products.

TLSR8208CER supports concurrent operation of multiple standards. In certain application scenarios, the chip can run two communication standards simultaneously in a single application state. For example, the low-power Bluetooth and 2.4GHz protocol stacks can work in parallel and interact with different devices via dual wireless communication channels. End products developed based on this mode can maintain a stable Bluetooth Smart connection with smartphones or other low-power Bluetooth devices while simultaneously controlling and communicating data with other 2.4GHz devices. In this mode, the chip is fully compatible with the Bluetooth standard, supports the low-power Bluetooth protocol specification, can easily pair and connect with smartphones, tablets, laptops, and other end devices that have Bluetooth Smart Ready functionality, and supports both master and slave modes in low-power Bluetooth, covering core functions such as advertising, encryption, connection updates, and channel map updates. Simultaneously, the chip supports the 2.4GHz standard and, when paired with mainstream 2.4GHz protocol stacks, can build high-performance smart home interconnectivity solutions. This characteristic allows products to establish a communication link between smartphones and smart home devices using only a single chip, eliminating the need for additional external gateways.

TLSR8208CER incorporates a hardware acceleration engine that can independently handle the various complex security computations required by Bluetooth protocols without needing an external Digital Signal Processor (DSP), significantly reducing the product's electronic Bill of Materials (eBOM) cost.

The chip integrates a rich set of on-chip peripheral interfaces and can directly connect to external components like LED lights, sensors, touch controllers, keyboards, and motors, making it an ideal solution for developing low-cost IoT devices and 2.4GHz wireless products.

Features

General Features

• 32-bit proprietary microcontroller

• Maximum operating frequency up to 48MHz

• Memory Architecture

• Program Memory: 512KB Flash or external Flash

• 16KB Data Retention Static Random Access Memory (SRAM)

• Supports 16KB One-Time Programmable (OTP) Memory

• Real-Time Clock (RTC) and Other Timers

• Clock sources include 24MHz and 32.768kHz crystal oscillators, and 32kHz/24MHz internal RC oscillators. The external 24MHz crystal oscillator is used to calibrate the internal 32kHz clock. The internal 32kHz oscillator is suitable for low-precision scenarios, and the external 32.768kHz crystal oscillator is suitable for high-precision scenarios.

• 3 General-purpose 32-bit timers supporting 4 optional operating modes in working mode.

• Watchdog Timer

• One 32kHz low-frequency timer supporting low-power mode.

• Rich Digital and Analog Interfaces

• General Purpose Input/Output (GPIO) count varies by package model: options for 38/16/33/10 channels. All digital I/O pins can be configured for GPIO functions.

• Serial Peripheral Interface (SPI)

• Inter-Integrated Circuit Bus (I²C)

• Universal Serial Bus Version 2.0 (USB 2.0)

• Universal Asynchronous Receiver/Transmitter (UART) supporting hardware flow control and 7816 protocol.

• Single-Wire Debug Interface (Swire)

• Up to 6 channels of differential Pulse Width Modulation (PWM)

• Infrared transmitter supporting Direct Memory Access (DMA)

• One Quadrature Decoder (QDEC) supporting two-phase signal input configuration.

• 14-bit auxiliary Analog-to-Digital Converter (ADC)

• Built-in hardware Advanced Encryption Standard (AES) block cipher module supporting 128-bit keys, also compatible with software AES-CCM protocol.

• Hardware-level Wireless Firmware Upgrade (OTA) functionality and multi-boot switching mechanism enable convenient product iteration and upgrades.

• Supports keypad scanning function, with a maximum support for an 8×18 matrix keyboard.

• Operating Temperature Range: -40°C to +85°C

• Package specifications fully compliant with the Restriction of Hazardous Substances (RoHS) Directive.

• 40-pin Quad Flat No-leads (QFN) package, size 5×5mm

RF Features

• Bluetooth/2.4GHz RF transceiver supporting the global 2.4GHz Industrial, Scientific, and Medical (ISM) band.

• Bluetooth Low Energy (BLE) 1Mbps and 2Mbps data rate modes.

• 2.4GHz proprietary protocol data rate modes: 1Mbps/2Mbps/250kbps/500kbps.

• Receiver Sensitivity: -97dBm in BLE 1Mbps mode; -93dBm in BLE 2Mbps mode.

• Transmitter Output Power: -45dBm to +10dBm.

• 50Ω impedance-matched single-pin antenna input.

• Received Signal Strength Indicator (RSSI) monitoring function with ±1dB resolution.

• Automatic Acknowledgment, Retransmission, and Flow Control mechanisms.

• Supports Packet Traffic Arbitration (PTA) for coexistence compatibility with Wi-Fi signals.

Power Management Features

• Built-in Low Dropout Linear Regulator (LDO).

• Battery Monitoring function: Supports low battery detection.

• Supply Voltage Ranges

• Chip Core Voltage (VDD): 1.8V to 3.6V

• Battery Voltage (VBAT): 1.8V to 4.2V

• Bus Voltage (VBUS): 4.5V to 5.5V

• Multi-level power management mechanism for optimal power consumption.

• RF/Digital core operating voltage is 1.2V.

• Low Power Consumption Specifications

• Full Chip Receive Mode (LDO On): 9.1mA

• Full Chip 0dBm Transmit Mode (LDO On): 9.5mA

• External Wake-up Deep Sleep Mode (No SRAM Data Retention): 0.55µA

• 16KB SRAM Data Retention Deep Sleep Mode: 0.9µA

• External Wake-up + 32kHz RC Oscillator On Deep Sleep Mode (No SRAM Data Retention): 1.0µA

• 16KB SRAM Data Retention + 32kHz RC Oscillator On Deep Sleep Mode: 1.3µA

Bluetooth Low Energy Features

• Compliant with Bluetooth 5.3 standard, supported core features include Bluetooth Low Energy 1Mbps and 2Mbps data rate modes.

Internal Block Diagram

Acroview's independently developed AP8000 universal programmer has become a benchmark professional programming solution in the industry. This device supports flexible and adjustable single-socket (1-to-1) and eight-socket (1-to-8) configurations and offers both online and offline operation modes. It has specially developed programming solutions for memory chips like eMMC and UFS and can comprehensively cover the offline bare-die and in-circuit programming needs of Telink's full chip series. The AP8000 adopts an innovative modular design with three core modules: Host, Baseboard, and Adapter Socket, granting the device excellent compatibility and expandability. As a universal programming platform, it can not only adapt to various programmable chips on the market but also, with its stable and efficient performance, serves as the core component of Acroview's automated mass programming equipment, the IPS5800S, enabling efficient handling of large-scale chip programming tasks to meet production demands.

The AP8000 Host features flexible connectivity options, equipped with both USB and NET interfaces for convenient networking of multiple programmers. Through networking, users can easily achieve synchronized control of multiple programmers for efficient parallel programming operations. Regarding safety, the host has a built-in intelligent safety protection circuit that monitors chip placement status and circuit connections in real-time. If abnormalities such as reversed chip insertion or short circuits are detected, it immediately triggers a power-off protection mechanism, comprehensively safeguarding the chip and programmer during operation. The host is internally equipped with a high-speed FPGA chip, significantly enhancing data transmission and processing efficiency to ensure a smooth and efficient programming process. To improve usability, the host's rear panel includes an SD card slot. Users can simply store the project file generated on the PC onto an SD card, insert it into the slot, and use the programmer's physical buttons to complete file selection, loading, and programming operations, enabling standalone operation without a PC. This design not only reduces dependency on computer hardware configuration but also simplifies the workflow setup, significantly improving operational flexibility.

In terms of expandability and compatibility, the AP8000 uses a modular combination design of baseboard and adapter boards, effectively expanding the host's functional boundaries. Currently, the device supports products from all major semiconductor manufacturers, covering well-known brands such as HAAWKING, XHSC, ZHIXIN, SAMSUNG, KIOXIA, etc. It supports a wide range of device types, including NAND, NOR, MCU, CPLD, FPGA, EMMC, and is fully compatible with various industry-standard file formats like Intel Hex, Motorola S, Binary, and POF, providing users with a one-stop, full-scenario chip programming solution.

Company Introduction

About Telink: Telink was founded in 2010 and is a professional integrated circuit design enterprise primarily engaged in the R&D, design, and sales of wireless IoT system-on-chips, focusing on the development and breakthroughs of cutting-edge technologies in the wireless IoT chip field. Through years of continuous effort and R&D accumulation, it has become one of the most representative enterprises globally with the most comprehensive product portfolio in this segment. Telink widely supports various consumer-grade and commercial-grade IoT applications, including smart retail, consumer electronics, smart lighting, smart home, smart healthcare, warehousing and logistics, and audio entertainment.

About Acroview: Acroview is a national-level "Little Giant" enterprise specializing in the R&D, production, and sales of semiconductor chip testing and programming equipment. The company is dedicated to empowering customers across the entire industry chain, including Fabless, IDM, OSAT, wafer Fabs, and end-device manufacturers, through innovative semiconductor testing technologies and solutions. Acroview's pioneering fully automatic burn-in test ABI (Auto Burn-In) system greatly improves customers' chip aging test efficiency and reduces per-DUT testing costs. Simultaneously, it provides customers with equipment products and solutions for various stages, from PSV, CP, FT, ABI, SLT, to programming. Acroview perfectly integrates its leading product technology advantages, system-level expertise, and globally distributed R&D and sales service network to create value for customers in gaining a competitive edge in the market.